Internship in Investigation of Failure Mechanisms in Printed Circuit Boards

During your internship, you will help shape the future as increased demands on printed circuit board technologies in the field of autonomous driving lead to greater stress on materials and design elements. You will provide helpful support and assist the team in investigating and evaluating damage from a reliability perspective. The supervision and evaluation of reliability studies and the determination of failure mechanisms (microsectioning, optical microscopy and other analytical methods such as scanning electron microscopy (SEM), laser scanning microscopy (LSM) and Fourier transform infrared spectroscopy (FTIR) will be an important part of your role. Finally, you will evaluate the experimental results statistically. This location offers Social counselling and intermediary service for care services Discounts for employees