The new drive concepts of e-mobility present special challenges for control units. Therefore, both the reliability of the printed circuit board and the assembly and interconnection technology are of increased importance. During your internship you will become part of our team for characterization of the high-frequency performance of PCB materials and design elements. You will measure, collect, and analyze data from High-Frequency PCBs with a special focus on implementation of quality data visualization and efficient data acquisition. Within our dynamic and interdisciplinary team, you will take an important position to improve our data acquisition setups.